Profile

MUHAMMAD NUBLI BIN ZULKIFLI, DR.

HEAD OF SECTION, BACHELOR OF ENGINEERING ELECTRICAL
UNIVERSITI KUALA LUMPUR BRITISH MALAYSIAN INSTITUTE

MNubliZ@unikl.edu.my

25 publications, 28 citations
Researcher Identities
ORCID ID : 
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Publication(s)
  Title Cited By Year

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

Izhan Abdullah, Azman Jalar, Muhammad Nubli Zulkifli, Roslina Ismail
Soldering and Surface Mount Technology

Feb 2017

Finite element analysis of thermoelectric generator with aluminum plate for waste heat recovery application

Zulkifli, M.N., Ilias, I., Abas, A., Muhamad, W.M.W.
International Journal on Advanced Science, Engineering and Information Technology

2017

Bondability and strength evaluation of gold ball bond using nanoindentation approach

Zulkifli, M.N., Jalar, A., Abdullah, S., Othman, N.K.
Key Engineering Materials

2016

Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium-Gold-Silver Metallization

Ismail, R., Harun, F., Zulkifli, M.N., Jalar, A., Bakar, M.A., Abdullah, S.
IEEE Transactions on Components, Packaging and Manufacturing Technology

2015

Effect of applied load in the nanoindentation of gold ball bonds

Zulkifli, M.N., Jalar, A., Abdullah, S., Rahman, I.A., Othman, N.K.
Journal of Electronic Materials

5 2013
 IR

Effect of applied load in the nanoindentation of gold ball bonds  

Zulkifli, M.N., Jalar, A., Abdullah, S., Rahman, I.A., Othman, N.K.
Journal of Electronic Materials , 42(6) , 1063-1072

2013
 IR

Effect of nanoindentation loading rate on gold ball bond

Zulkifli, M.N., Jalar, A., Abdullah, S.
Materials Science Forum , 756 , 151-155

2013

Strength distribution of Au ball bond using nanoindentation approach

Zulkifli, M.N., Jalar, A., Abdullah, S., Rahman, I.A., Hamid, M.A.A.
Materials Science and Engineering A

3 2013
 IR

Strength distribution of Au ball bond using nanoindentation approach  

Zulkifli, M.N., Jalar, A., Abdullah, S., Rahman, I.A., Hamid, M.A.A.
Materials Science and Engineering A , 577 , 189-196

2013

Hardness variation of ball bond wire bonding

Zulkifli, M.N., Jalar, A., Abdullah, S., Shamsudin, R., Zulkifli, R.
Advanced Materials Research

1 2012

Nanoindentation creep analysis of gold ball bond

Zulkifli, M.N., Jalar, A., Abdullah, S., Othman, N.K., Hamid, M.A.A.
2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings

1 2012
 IR

Nanoindentation creep analysis of gold ball bond  

Zulkifli, M.N., Jalar, A., Abdullah, S., Othman, N.K., Hamid, M.A.A.
2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012  , 755-758

2012

Nanoindentation stereometry of wire bonding

Zulkifli, M.N., Jalar, A., Abdullah, S., Othman, N.K.
Advanced Science Letters

2012
 IR

Nanoindentation stereometry of wire bonding 

Muhammad Nubli Zulkifli , Jalar, Azman,  Abdullah, Shahrum, Othman, Norinsan Kamil
Advanced Science Letter , 13(1) , 474-477

2012
 IR

Some thoughts on bondability and strength of gold wire bonding

Muhammad Nubli Zulkifli, Shahrum Abdullah, Norinsan Kamil Othman, Azman Jalar
Gold Bulletin , 45(3) , 115-125

2012
 IR

Temperature cycling analysis for ball grid array package using finite element analysis

Muhammad Nubli Zulkifli , Zul Azhar Zahid Jamal, Ghulam Abdul Quadir 
Microelectronics International , 28(1) , 17-28

2011
 IR

Hardness variation of ball bond wire bonding  

Zulkifli, M.N., Jalar.A, A.,Abdullah, S.,Shamsudin, R.,Zulkifli, R.
Advanced Materials Research , 399-401 , 1048-1051

2011

Nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds

Abdullah, S., Zulkifli, M.N., Jalar, A.
Advanced Materials Research

2011

Nanoindentation test for the stiffness distribution analysis of bonded Au ball bonds

Othman, N.K., Zulkifli, M.N., Jalar, A., Abdullah, S.
Advanced Materials Research

2011

Nanoindentation test for the strength distribution analysis of bonded Au ball bonds

Jalar, A., Zulkifli, M.N., Abdullah, S.
Advanced Materials Research

9 2011

Temperature cycling analysis for ball grid array package using finite element analysis

Zulkifli, M.N., Jamal, Z.A.Z., Quadir, G.A.
Microelectronics International

14 2011

The re-evaluation of mechanical properties of wire bonding

Jalar, A., Zulkifli, M.N., Othman, N.K., Abdullah, S.
Proceedings - International Symposium on Advanced Packaging Materials

1 2011
 IR

The re-evaluation of mechanical properties of wire bonding  

Jalar.A,  M. N. Zulkifli , N. K. Othman, S. Abdullah
Advanced Packaging Materials (APM), 2011 International Symposium on , 226-233

2011

Effect of Nanoindentation Loading Rate on Gold Ball Bond

Muhammad Nubli Zulkifli, Azman Jalar, Shahrum Abdullah

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

UniKL Researcher - MUHAMMAD NUBLI ZULKIFLI