Profile

MIOR FIRDAUS BIN MIOR ABD MAJID

LECTURER
MECHANICAL SECT
UNIVERSITI KUALA LUMPUR MALAYSIAN SPANISH INSTITUTE

miorfirdaus@unikl.edu.my

10 publications
Researcher Identities
ORCID ID : 
ResearchGate : 
Expert Area(s)
Division Category Group Area
Natural Science MATHEMATICAL SCIENCES Mathematics and Statistics for Science and Engineering Fluid Mechanics
Thermodynamics and Heat Transfer
ENGINEERING AND TECHNOLOGY ENGINEERING AND TECHNOLOGY Mechanical Engineering Other Mechanical Engineering n.e.c.
Interdisplinary Engineering Fluid Mechanics
Publication(s)
  Title Cited By Year

STUDY OF UNDERWATER THRUSTER (UT) FRONT COVER OF MSI300 AUTONOMOUS UNDERWATER VEHICLE (AUV) USING FINITE ELEMENT ANALYSIS (FEA)

M. Sabri, T Ahmad, M.F.M.A Majid, A B Muhamad Husaini
Regional Conference on Marine & Mechanical Engineering 2016 (ReMME'16)

Oct 2016

3D Simulation of Three-Dimensional Filling Process for Stacked-Chip Scale Packages (S-CSPs)

M.F.M.A Majid, M. Sabri, M Husaini, K. Shahril, M.Z. Abdullah
Colloquium of Education, Engineering & Technology 2014 (COLEET 2014)

Oct 2014

A Review on Current Trend in Sustainable Manufacturing in Industries

Shukri Zain, M.F.M.A Majid, M Sabri Sidik, Zaileen S Saari
Colloquium of Education, Engineering & Technology 2014 (COLEET 2014)

Oct 2014

Analysis of Temperature Distribution Behavior of Motorcycle Brake Pads

K. Shahril, M. Khairuddin Hj. Ali Musa, M. Sabri, M.F.M.A Majid, Muhamad Husaini
COLLOQUIUM ON EDUCATION, ENGINEERING AND TECHNOLOGY

2 Oct 2014

Design Analysis of Joining Metal and Glass Fiber Reinforced Plastics (GFRP)

M. Sabri, A Afirien, Nurulhuda Amri, K. Shahril, Muhamad Husaini
Colloquium of Education, Engineering & Technology 2014 (COLEET 2014)

Oct 2014

Experimental Investigation on Thermal Performance of a Vapour Chamber for Electronic Cooling

Fatin AMIRAH Idrus, Yusli Yaakob, Muhammad IKHWAN SHAFIQ Abdul Razak, Azli Abd Razak, M.F.M.A Majid
4th International Conference on Science & Technology: Applications in Industry & Education (ICSTIE 2012)

Oct 2012

Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging

M.F.M.A Majid, C.Y. Khor, M.K. Abdullah, M.Z. Abdullah, Mohd Aris
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International

1 Nov 2012

Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages

C.Y. Khor, M.K. Abdullah, M.Z. Abdullah, Dr. Muhammad Abdul Mujeebu, Z. M. Ariff
Heat and Mass Transfer

20 Dec 2010

Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process

C.Y. Khor, M.Z. Abdullah, M.K. Abdullah, Dr. Muhammad Abdul Mujeebu, M. R. Abdul Rahman
International Journal of Heat and Mass Transfer

32 Apr 2011
 IR

Fundamental Studies On Development Of MHD (Magnetohydrodynamic) Generator Implement On Wave Energy Harvesting

Mior Firdaus Bin Mior Abd Majid
iMEC 2015 ( 2nd International Manufacturing Engineering Conference) & APCOMS (3rd Asia-Pacific Conference On Manufacturing Systems)

2015
UniKL Researcher - MIOR FIRDAUS MIOR ABD MAJID